Bibliometric Analysis of the Integration of Heat Pipes and Thermosyphons in Building Envelopes
DOI:
https://doi.org/10.46421/entac.v20i1.5918Keywords:
Bibliometric Analysis, : Heat Pipes, Thermosyphon., BuildingsAbstract
Due to the urgent need to reduce energy consumption caused by the current climate scenario, new heat transfer technologies in building envelopes to control indoor temperatures with lower energy costs have received more attention in recent years. Among these technologies are heat pipes (HP) and thermosyphons (TS), which operate passively, without the requirement of any additional energy costs. A bibliometric analysis was conducted regarding integrating HPs and TSs into building envelopes. Searches were conducted between September and October of 2023, using 2 search strings in 3 indexing databases (Scopus, Web of Science, and EBSCO). A search on Google Scholar was also performed using the Snowball method, where 74 articles were selected. A predominance of Chinese authors was observed regarding the research on walls equipped with HPs and TSs. These works were the basis of more advanced research conducted in the United Kingdom and the United States. In general, the increasing interest in the topic in the last decade can be noted, demonstrating the technology's relevance.
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